*恭喜浙江省农业科学院俞老师在SCI期刊 Environmental Science and Pollution Research(IF:2.914)上成功发表
*恭喜西安理工大学张老师,环境水利专业,文章成功发表在SCI期刊Environmental Science and Pollution Research上,IF2.914
*恭喜山东交通学院谢老师在SCI期刊APPLIED SURFACE SCIENCE(IF5.15)上成功发表
*恭喜华中科技大学黄老师在SCI期刊 ACS Applied Materials & Interfaces(IF8.456)上成功发表
*恭喜中南大学湘雅医院黄医生在Frontiers in Oncology(IF 4.137)上成功发表
*恭喜复旦大学辛博士在SCI期刊 FEBS LETTERS(IF2.675)上成功发表
*恭喜中南大学陈博士在THIN-WALLED STRUCTURESSCI期刊(IF3.488)上成功发表
*恭喜湖南工学院郭老师在SCI期刊SIMULATION MODELLING PRACTICE AND THEORY(IF2.42)上成功发表
*恭喜东华大学闫老师在SCI期刊Advanced Functional Materials(IF 15.621)上成功发表
*恭喜安徽医科大学肖老师在SCI期刊BMC CELL BIOLOGY(IF 3.485)上成功发表
*恭喜四川大学华西医院谢医生在SCI期刊European Heart Journal: Acute Cardiovascular Care(IF 3.734)上成功发表

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2021年最新SCI期刊影响因子查询系统

期刊名称:
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MATERIALS SCIENCE AND TECHNOLOGY 期刊详细信息

基本信息
期刊名称 MATERIALS SCIENCE AND TECHNOLOGY
MATERIALS SCIENCE AND TECHNOLOGY
期刊ISSN 0267-0836
期刊官方网站 http://www.elsevier.com/wps/find/journaldescription.cws_home/600849/description#description
是否OA
出版商 Elsevier Ltd
出版周期 Bimonthly
始发年份
年文章数 412
最新影响因子 2.06(2021)
中科院SCI期刊分区
大类学科 小类学科 Top 综述
工程技术3区 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气3区
MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科学:综合3区
PHYSICS, APPLIED 物理:应用3区
PHYSICS, CONDENSED MATTER 物理:凝聚态物理3区
CiteScore
CiteScore排名 CiteScore SJR SNIP
学科 排名 百分位 2.83 0.633 1.063
Engineering
Mechanics of Materials
77 / 352 78%
Physics and Astronomy
Condensed Matter Physics
84 / 397 78%
Engineering
Industrial and Manufacturing Engineering
104 / 579 82%
Materials Science
General Materials Science
115 / 439 73%
补充信息
自引率 7.30%
H-index 43
SCI收录状况 Science Citation Index Science Citation Index Expanded
官方审稿时间
网友分享审稿时间 数据统计中,敬请期待。
PubMed Central (PML) http://www.ncbi.nlm.nih.gov/nlmcatalog?term=1369-8001%5BISSN%5D
投稿指南
期刊投稿网址 http://ees.elsevier.com/mssp/
收稿范围
Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.
Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energyconversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications.
Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.
收录体裁
Original research papers, reviews, letters to the editor.
投稿指南 https://www.elsevier.com/journals/materials-science-in-semiconductor-processing/1369-8001/guide-for-authors
投稿模板
参考文献格式 https://www.elsevier.com/journals/materials-science-in-semiconductor-processing/1369-8001/guide-for-authors
编辑信息
近期成功发表案例展示