2021年最新SCI期刊影响因子查询系统
MATERIALS SCIENCE AND TECHNOLOGY 期刊详细信息
基本信息
期刊名称 | MATERIALS SCIENCE AND TECHNOLOGY MATERIALS SCIENCE AND TECHNOLOGY |
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期刊ISSN | 0267-0836 |
期刊官方网站 | http://www.elsevier.com/wps/find/journaldescription.cws_home/600849/description#description |
是否OA | 否 |
出版商 | Elsevier Ltd |
出版周期 | Bimonthly |
始发年份 | |
年文章数 | 412 |
最新影响因子 | 2.06(2021) |
中科院SCI期刊分区
大类学科 | 小类学科 | Top | 综述 |
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工程技术3区 | ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气3区 | 否 | 否 |
MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科学:综合3区 | |||
PHYSICS, APPLIED 物理:应用3区 | |||
PHYSICS, CONDENSED MATTER 物理:凝聚态物理3区 |
CiteScore
CiteScore排名 | CiteScore | SJR | SNIP | ||
---|---|---|---|---|---|
学科 | 排名 | 百分位 | 2.83 | 0.633 | 1.063 |
Engineering Mechanics of Materials |
77 / 352 | 78% |
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Physics and Astronomy Condensed Matter Physics |
84 / 397 | 78% |
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Engineering Industrial and Manufacturing Engineering |
104 / 579 | 82% |
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Materials Science General Materials Science |
115 / 439 | 73% |
补充信息
自引率 | 7.30% |
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H-index | 43 |
SCI收录状况 |
Science Citation Index
Science Citation Index Expanded |
官方审稿时间 | |
网友分享审稿时间 | 数据统计中,敬请期待。 |
PubMed Central (PML) | http://www.ncbi.nlm.nih.gov/nlmcatalog?term=1369-8001%5BISSN%5D |
投稿指南
期刊投稿网址 | http://ees.elsevier.com/mssp/ |
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收稿范围 | Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy. Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energyconversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications. Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects. |
收录体裁 | Original research papers, reviews, letters to the editor. |
投稿指南 | https://www.elsevier.com/journals/materials-science-in-semiconductor-processing/1369-8001/guide-for-authors |
投稿模板 | |
参考文献格式 | https://www.elsevier.com/journals/materials-science-in-semiconductor-processing/1369-8001/guide-for-authors |
编辑信息 |